Thermal Clay

導熱黏土 Thermal Clay

SR-800CP Thermal Clay

SR Series

Thermal clay is composed of silicone carrier and high loading of thermally conductive fillers. SR-800 series thermal clay, with very low thermal resistance, can be deformed without any tools or fixtures and can be easily applied to uneven interstices or winding without dripping.

  • Great heat dissipation
  • low thermal resistance
  • Highly deformable
  • Excellent gap filling
  • Meet UL 94V-0 flame rating
Category  Item  Unit  SR-800CP  SR-800CS  Test Method 
Physical-Related  Main Polymer  Silicone  Silicone 
Color  Light Grey Light Grey Visual 
Thickness Range  mm  3.0~6.0  N/A  ASTM D374 
Specific Gravity  g/cm³  2.1 2.6 ASTM D792 
Hardness  Shore OO  45 N/A  ASTM D2240 
Weight Loss  <1  <1  120°C /24hrs 
Electrical-Related  Surface Resistance  Ω  >1014 >1014 ASTM D257 
Volume Resistivity  Ω.cm  >1014 >1014 ASTM D257 
Thermal-Related  ThermalResistance  ˚C*in2/W  <0.38  <0.12  ASTM D5470 
Thermal Conductivity  W/m.k  0.8 1.5 ASTM D5470 
Temperature Range  °C   -40~150   -40~150 
Certification UL File No. E227890 94 V-0
Hazardous
Substance Free
RoHS Compliance SGS/CTI
Halogens free Compliance SGS/CTI
REACH Compliance SGS/CTI